Glycine Air Polishing Powder for Supra- and Subgingival Use 25 μm
SKU
W-SUP+SUB-G
The W-SUP+SUB-G air polishing powder is formulated with 25 μm glycine for both supra- and subgingival air polishing. Its low-abrasive formula effectively removes biofilm while preserving soft tissues, making it ideal for periodontal maintenance, implant care, orthodontic patients, restorations and paediatric dentistry.
25 μm Glycine Air Polishing Powder for Supra- and Subgingival Applications
The W-SUP+SUB-G air polishing powder is formulated with 25 μm glycine, providing highly effective biofilm removal while being gentle on soft tissues and tooth surfaces. Its ultra-fine particle size makes it suitable for both supragingival and subgingival air polishing, offering predictable clinical performance in preventive and periodontal care.
Its low abrasiveness makes it an excellent choice for regular maintenance procedures, allowing clinicians to remove biofilm efficiently while maximising patient comfort.
Clinical indications
Suitable for:
Supra- and subgingival prophylaxis.
Periodontal maintenance therapy.
Peri-implant maintenance.
Implant cleaning.
Orthodontic patients.
Cleaning around restorative materials.
Paediatric dentistry.
Biofilm management in sensitive areas.
Features
Glycine air polishing powder.
Ultra-fine 25 μm particle size.
Suitable for supra- and subgingival applications.
Low-abrasive formulation.
Effective biofilm removal.
Gentle on soft tissues, enamel and restorative materials.
Ideal for periodontal and peri-implant maintenance.
Compatible with air polishing systems designed for glycine powders.